TGA (Thermal Gravimetric Analyzer)

Application: Measuring the thermal resistance and initial temperature of cracking after resin curing, as well as calculating parameters of cracking dynamics for the resin. Measuring the content of resin filling and the coking rate after resin cracking. With its automatic feeding system, the Q500 machine can place 16 sets of samples for automatic experiment and measurement in amount and rate of weight change.
Machine: TA Instruments Inc.TGA- Q500